Job Responsibilities:

• Developing wafer bonding process to meet the physical & electrical requirements of Micron’s products.
• Optimizing wafer bonding processes to reduce cost, process variability, and improve process capability.
• Collaborating with process integration and other process development teams to develop innovative new solutions.
• Conducting root cause and failure mode analysis to understand the limitations of current hardware and driving vendors for solutions.
• Performing fundamental research to drive innovative solutions for next-generation products.
• Maintaining a technology development pilot manufacturing line.
• Support process transfer to production facilities (some domestic and/or international travel may be required).

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